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Warbler
3rd Optical Inspection System
Inspection of lead frame after wire bond or die attach
Punch or laser marking module for reject identification
Auto conversion for different package type
Equipped with strip mapping system
Side inspection for wire loop height
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Copyright © 2017 JSI Systems Sdn. Bhd.
All rights reserved.
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Privacy
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Copyright © 2017 JSI Systems Sdn. Bhd.
All rights reserved.