Solutions

• Die Coating Inspection System (July 18, 2025)
• Leadframe Reel-to-Reel Inspection System (July 18, 2025)
• Automated Leadframe Dispensing System (July 18, 2025)
• Leadframe Laser Marking System (July 18, 2025)
• WBG Pick and Place Machine (July 18, 2025)
• Flip-Chip Inspection System (July 18, 2025)
• Component Tape & Reel System (July 18, 2025)
• Automated Wafer Carrier System (July 17, 2025)
• Automated Leadframe Transfer System (July 17, 2025)
• Die Attach Curing System and Solder Reflow (July 17, 2025)
• JEDEC Tray Handling System (July 17, 2025)
• Loader Unloader System (July 17, 2025)
• 3rd Optical Inspection System (October 19, 2024)
• In-line Assembly Inspection System (October 19, 2024)
• Leadframe AOI System (October 9, 2024)