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Solutions

  • 3rd Optical Inspection System
  • Automated Leadframe Dispensing System
  • Automated Leadframe Transfer System
  • Automated Wafer Carrier System
  • Component Tape & Reel System
  • Die Attach Curing System and Solder Reflow
  • Die Coating Inspection System
  • Flip-Chip Inspection System
  • In-line Assembly Inspection System
  • JEDEC Tray Handling System
  • Leadframe AOI System
  • Leadframe Laser Marking System
  • Leadframe Reel-to-Reel Inspection System
  • Loader Unloader System
  • WBG Pick and Place Machine
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